Anodized Aluminum Bond Puck
Anodized Aluminum Bond Puck
Anodized aluminum bond puck for holding our chip carriers during conductive epoxy wire bonding and transferring to the hot plate. M4 stainless steel knob can be inserted to safely take the bond puck off of the hot plate after curing. M2 screws can be positioned at 30, 29, 28, and 25 mm spacing, which corresponds to our chip carriers' spacing for different stage designs. The anodized surface is perfect for verifying temperature with a thermal imaging camera.